LG Q9 Pops Up on Geekbench With Snapdragon 821 SoC and 4GB RAM

Just like the LG G7 Fit, the upcoming Q9 will run on the dated Snapdragon 821 chipset.

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LG’s upcoming mid-range Android smartphone, the Q9 has made an appearance on the Geekbench benchmark database. The Geekbench listing suggests the smartphone may not be powered by Qualcomm’s Snapdragon 660 SoC.

LG Q9 to be Powered by a Dated Snapdragon 821 SoC

Some rumors have been claiming that the LG Q9 will be powered by a 14nm Qualcomm Snapdragon 660 octa-core processor under the hood, paired with 4GB of RAM. However, the LG LM-Q925L Geekbench listing makes it quite clear that the handset will run on a Snapdragon 821 quad-core processor instead. This is certainly not surprising, however, as the smartphone is expected to be largely identical to the G7 Fit that was unveiled in August last year. As shown by various leaked renders of the smartphone, the Q9 will be nearly identical to the G7 Fit in terms of overall design as well.

The LG Q9 managed to score 1,789 points in the single-core test and 3,680 points in the multi-core test. Quite clearly, the LG Q9 will not be a best-in-class device in terms of performance. In terms of software, it looks like the Q9 may ship with Android 8.1 Oreo and not the latest Android 9 Pie, which is certainly going to be disappointing. Going by previous leaks, the LG Q9 will sport a 6.1-inch notched IPS LCD display with 1080 x 2280 pixels Full HD+ resolution. It is expected to be available in a single memory configuration with 4GB of RAM and 64GB of internal storage. For further expansion, the Q9 will include a microSD card slot. In terms of optics, the smartphone is rumored to feature a 16MP primary camera on the back and an 8MP selfie snapper on the front. Connectivity-wise, the LG Q9 is expected to support Wi-Fi 802.11 a/b/g/n/ac dual-band, Bluetooth 5.0 Low Energy, GPS with A-GPS, GLONASS, BeiDou, NFC, USB 3.1 Type-C port, and 4G VoLTE. The smartphone could be fueled by a 3550mAh non-removable battery with Qualcomm Quick Charge 3.0 support. It is also expected to have a rear-mounted fingerprint sensor, IP68 certification for dust and water resistance as well as MIL-STD-810G compliance. The smartphone is tipped to be made official before the end of this month.