LeEco Le Max 3 with metal unibody design and dual cameras leaks ahead of launch

Chinese smartphone manufacturer LeEco is rumoured to debut the LeEco Le X850 aka Le Max 3 on April 11. While the phone received TENAA certification last year, the company has taken its own time to launching this device. Now prior to the rumoured April 11 launch, leaked images of the Le Max 3 have surfaced online giving us a glimpse of the device. The smartphone appears to have a metal unibody design, a dual camera setup with an LED flash and a circular rear-facing fingerprint sensor.

The Le Max 3 is said to feature a 5.7-inch Quad HD display that has a resolution of 1440x2560p. The smartphone is rumoured to come equipped with a Snapdragon 821 SoC with 4GB of RAM and 64GB of internal storage onboard.  It is rumoured to run on Android 6.0 Marshmallow out-of-the-box with EUI on top of it.