Qualcomm has started working on its next high-end chipset Snapdragon 845 in collaboration with Samsung. The chipset, which is said to be manufactured using the 10nm process, was spotted on the company’s official site some time ago. Now, a new specification sheet of this SoC has been leaked on Weibo, giving us a glimpse of what the actual chipset might come equipped with. The specifications of the Snapdragon 845 have been compared with that of Huawei’s Kirin 970 chipset, which is also said to be in the pipeline.
The sheet suggests that the Snapdragon 845 could be manufactured using the 10nm processor, which contradicts the earlier leak about a 7nm one that was spotted on the company’s site. The leakster also believes that these are more definite specifications of the Snapdragon 845 which is said to debut in Q1 2018. Additionally, this might also be the first time where the manufacturing process is the same as that of its predecessor. The Snapdragon 845 might have four Cortex A75 cores, four Cortex A53 cores, LTE X20 modem, Wi-Fi 802.11 ad, UFS 2.1 storage and 4GB of LPDDR4 RAM.
The sheet also mentions the specs of the upcoming Kirin 970 SoC which is said to debut in Q3-Q4 2017. The Kirin 970 is said to be manufactured using the 10nm FinFET process which could have the same architecture as that of the Snapdragon 845. The SoC is also said to have a Wi-Fi 802.11 ac standard compared to 802.11ad, 4GB of RAM, and UFS 2.1 storage.
As of now, there is no word as to when the company might debut these SoCs. We suggest you take information related to the Snapdragon 845 with a pinch of salt as it might also come with Cortex A75 cores which is yet to make its debut officially.