The Snapdragon 855 Fusion Platform release will provide a beginning to the next stage of high-speed data connections, thanks to the Snapdragon X50 5G modem that will be embedded in the chipset.
In the latest financial earnings of Softbank, the company has detailed that both the Snapdragon 855 Fusion Platform and the Snapdragon X50 5G modem are in the development phase, with Qualcomm’s battle cry being the branching out of 5G connectivity to various parts of the globe.
With the Snapdragon 845 being made on the existing 10nm technology, it would make complete sense for Qualcomm to spend the extra money and choose a new and more advanced, 7nm manufacturing process from TSMC for the succeeding chipset.
Snapdragon 855 Fusion Platform + Snapdragon X50 5G Modem: Specifications and Features
Qualcomm’s contractors had already leaked critical information that the Snapdragon 855 is going to be made on the 7nm process, thus signaling that apart from being much faster than the Snapdragon 845, it will deliver better power efficiency. This level of efficiency means that most future smartphones will be able to deliver better battery life, thanks to the Qualcomm Snapdragon 855. Another perk that it grants Qualcomm is being able to increase the number of cores and clock speed for both the custom CPU cores and the GPU to give it better overall compute and graphical performance.
Softbank Japan says this is what's next from Qualcomm: The Snapdragon 855 Fusion Platform consisting of the SDM855 and the SDX50 Modem (5G). Taken from their official earnings presentation: https://t.co/LR9k4h165N pic.twitter.com/2Ceb6MCnNI
— Roland Quandt (@rquandt) March 7, 2018
Unfortunately, there is no information centred around the number of cores, clock speed or GPU frequency that will be active in the Snapdragon 855. Also, it is not just going to be smartphones and tablets taking advantage of the latest and greatest features of the 7nm chipset. Windows 10-based notebook computers that currently feature a Snapdragon 835 SoC will eventually start to bear a Snapdragon 855 chip, meaning potentially faster processing and better battery life.
Where companies like ASUS and HP have introduced 2-in-1 devices that can deliver between 20-22 hours of battery endurance, perhaps the Snapdragon 855 will be able to project faster mobile connectivity and even better battery life. An earlier report had claimed that the Snapdragon 855 chipset would be manufactured on TSMC’s 7nm process, but even though Qualcomm has not yet confirmed this, we do not necessarily require the company’s spokespersons to become mouthpieces when seeking information.
It is often the company’s contractors that give users the information we need before the official announcement of products.