Honor is gearing up for the launch of the Magic 3 series in China. The company is expected to launch its flagship series on August 12. Honor’s CEO George Zhao recently teased the device’s rear panel. It suggested that the phone has five camera sensors on the back. It also has cutouts for the microphone, LED flash, etc. on the back. Other details of the device have not yet been officially confirmed. Ahead of the launch, the Magic 3 series phone has visited the Geekbench website. The listing reveals some key details of the upcoming Honor smartphone. Let’s take a look at the Honor Magic 3 series specs, features and other details leaked via Geekbench.
Honor Magic 3 series Geekbench
Honor is expected to unveil the Magic 3 series on August 12. Ahead of the launch, the phone is listed on the Geekbench website. The listing on Geekbench confirms that the device will draw power from a Qualcomm Snapdragon 888 Plus SoC. The ‘Plus’ variant gets two major performance improvements. The SoC’s prime core CPU gets boosted to 2.995GHz, compared to 2.84GHz on the SD888 SoC. It also gets 20 per cent improved AI performance over the SD888 SoC. The processor is paired with Adreno 660 GPU.
