Huawei HiAI 2.0 Platform Based on HiSilicon 980 Chipset Launched for Mobiles, Tablets, Laptops

The Huawei HiAI 2.0 is an interesting collaborative platform from Huawei wherein vendors can utilize the powerful AI capabilities to offer solutions for a diverse set of electronics.

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Huawei has launched the second generation of it Artificial Intelligence or AI platform. Interestingly, the scope of the vendor-accessible and tweak-able HiAI 2.0 platform now has a much larger scope.

Huawei launched HiAI 2.0, a unique AI platform that will not only benefit the Chinese smartphone giant, but also the vendors that the company works with. Incidentally, the HiAI platform will cover several more “Smart” electronics, including tablets, laptops and set-top boxes. However, the platform requires some serious neural processing power and currently, processors that pack such NPUs are a rarity.

Huawei HiAI 2.0 Platform Scope, Availability

The HiAI 2.0 platform is actually an upgraded version of the HiAI 1.0 platform. The previous AI-driven HiAI 1.0 had three core aspects, one of which was extracting and processing visual data captured from the powerful imaging sensors embedded in the Huawei smartphones. Huawei established the HiAI platform to allow more vendors to join the company’s AI ecosystem. Using the already developed resources and algorithms, vendors working with Huawei could develop and establish their own sub-platforms and solutions. In essence, Huawei wants its vendors should benefit from its AI research. It wants them to offer new and innovative solutions that rely on the HiAI platform.

The Huawei HiAI platform is a significantly further step and in extension, should help several more diverse vendors, including those who make tablets, laptops and set-top boxes. Essentially, the HiAI 2.0 continues the architecture of the HiAI 1.0 platform. But Huawei assures all the aspects of the AI platform are significantly enhanced.

Huawei HiAI 2.0 Platform Requires HiSilicon Kirin 980 SoC

The Huawei HiAI 2.0 platform requires the HiSilicon 980 chip as its base. The latest technological marvel in silicon chip manufacturing, the Kirin 980 chipset is fabricated on the 7nm fabrication process. The Kirin 980 is reportedly twice as powerful as its immediate predecessor, the Kirin 970. Moreover, the next-generation processor comes with the highly unique Dual NPU architecture.

The HiAI 2.0 platform significantly relies on the benefits and processing prowess of the Kirin 980 SoC. The platform has more API capabilities and scenario applications. Moreover, it will cover a wide range of Android handsets, and several other digital products.

Huawei is promising the HiAI 2.0 platform will cover several electronics, including IoT devices, and devices that are affordable to own. However, it is quite apparent the Chinese company will not embed its flagship mobile processor with exceptional processing power and other top-end features, in every device that will reportedly benefit from the HiAI 2.0 platform. Hence, it is unclear how exactly will Huawei extend the HiAI 2.0 platform to these electronics.

It is possible Huawei may be looking at a virtual bridge that might help the electronics outsource the processing of the information to the Huawei smartphones with the Kirin 980 SoC that are in the vicinity. But this is mere speculation. Moreover, Huawei smartphones featuring the Kirin 980 processor are just launching in the market.