Intel recently announced the launch of its 9th Gen core CPUs which are compatible with the Coffee Lake and Z370 platforms. However, the 9th Gen core CPU was accompanied by a new Z390 chipset and motherboards.
The Core i9-9900K, Intel’s latest flagship processor and comes with eight cores having a base frequency of 3.6GHz at 95W TDP and hyper-threading. It also has a turbo of up to 5GHz on two cores. There is dual channel memory support as well. The Core i9-9900K is a step above the Core i7-8086K as the latter is equipped with two more cores and also the 5GHz turbo has been increased from one to two. The Core i9 family will have the full 2MB of L3 cache per core. The Core i7-9700K too features 8-cores but lacks hyper-threading. Both the Core i7-9700K and i7-8700K are built on the same Coffee Lake microarchitecture, the 9700K ships with two extra cores and also have a better turbo performance.
Intel also confirmed that their latest 9th Gen CPUs will come with a layer of solder which makes up the TIM (Thermal Interface Material) between the die and IHS (Integrated Heat Spreader). The processors which is supposed to include the solder are the Core i9-9900K, Core i7-9700K and Core i5 9600K. If we look at recent past, Intel has always opted for a cheaper thermal interface which compared to solder has a lower heat conduction rating. The move to include solder in the new Intel 9th generation processors will definitely boost performance.
Moving over to the new Z390 chipset which accommodates the Intel’s 9th Gen Core processors based on 14nm++ also brings two new features. These include Gigabit Wireless 802.11 AC along with USB 3.1 Gen 2 support, out of the box. While the last generation chipsets had to rely on third-party for USB 3.1 Gen 2 with 10Gbps speed; the Z390 has the support from scratch which ensures faster data transfers. While the integration of Gigabit Wireless 802.11 AC is a welcome move, most high-end motherboards already have the feature in-built.
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