MediaTek Dimensity 8100, Dimensity 8000 5nm SoCs and Dimensity 1300 6nm SoC Announced: Specifications, Upcoming Featured Smartphones

Redmi, Oppo, OnePlus, Realme phones are confirmed to features these new chipsets.


Chipset maker MediaTek has announced three new mobile processors under its popular Dimensity series today. The company has unveiled two new chipsets in the 8000 series, the Dimensity 8000 and Dimensity 8100.

Along with the duo, the brand has also announced the Dimensity 1300, which is a mid-range chipset and the successor to the Dimensity 1200 from 2021. Let’s take a look at the features and specifications of the new Dimensity processors in detail.

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MediaTek Dimensity 8000 and Dimensity 8100 Features

Both the Dimensity 8000 and 8100 have most of the features identical. Starting off with the CPU, these chips are built based on TSMC’s 5nm process with eight cores. The Dimensity 8100 comes with four premium Arm Cortex-A78 cores with a clock speed of up to 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz. Both come with four Cortex-A55 cores and Arm Mali-G610 MC6 GPU with HyperEngine 5.0 gaming suite, which offers support for up to 170fps gaming. MediaTek Dimensity 8000Further, in terms of memory, they support quad-channel LPDDR5 RAM and UFS 3.1 storage. These chipsets use MediaTek’s Open Resource Architecture (DORA), which means phone makers can customize and add features to their devices. Last year, OnePlus Nord 2 was powered by Dimensity 1200 AI SoC wherein OnePlus worked on the DORA platform to improve the camera and display performance. There is also the fifth-gen AI processing unit, APU 580 which is said to deliver power-efficient performance, AI optimization, and more.

The MediaTek Dimensity 8000 and Dimensity 8100 offer support for up to 200MP cameras and 4K at 60 fps and HDR10+ videography. It is also capable of recording dual-camera HDR video recording. In terms of network, these SoCs are 5G ready and they come with 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier aggregation. Other features include NavIC support, UltraSave 2.0 power-saving enhancement suite, Wi-Fi 6E and Bluetooth 5.3. The Dimensity 8100 and 8000 supports up to 120Hz refresh rate on WQHD+ resolution or 168Hz on full HD+ display.

MediaTek Dimensity 1300 Features

The company also announced the MediaTek Dimensity 1300, which is a mid-range SoC and successor to the Dimensity 1200. This chipset is built on a 6nm process and it is also an octa-core chip with one ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with a 9 core Arm Mali-G77 GPU and MediaTek APU 3.0 to support the AI capabilities.

The chipset supports up to 200MP cameras and is also integrated with MediaTek’s HyperEngine 5.0. It comes with new AI enhancements, night photography improvements and HDR capabilities for great image clarity. Other features include 5G, Wi-Fi 6 (a/b/g/n/ac/ax), NavIC support and Bluetooth 5.2. Realme GT Neo 3

Smartphones powered by the Dimensity 8100, Dimensity 8000 and Dimensity 1300 will be available in the market in the first quarter of 2022, powering a new era of incredible 5G devices by some of the world’s biggest smartphone brands.

MediaTek has confirmed phones with Dimensity 8100, Dimensity 8000 and Dimensity 1300 will be available in the market in the first quarter of 2022.

Phones with Dimensity 8000, Dimensity 8100, Dimensity 1300 Confirmed

  1. Realme GT Neo 3 一 Dimensity 8100
  2. Redmi K50 Pro 一 Dimensity 8100
  3. Oppo K10 一 Dimensity 8000
  4. OnePlus Nord 2T 一 Dimensity 1300
  5. OnePlus phone 一  Dimensity 8100