HONOR will launch its first clamshell foldable in China, the HONOR Magic V Flip on June 13. Today, we have spotted the smartphone in the Geekbench, which confirms the chipset details ahead of the launch.
HONOR Magic V Flip Geekbench Listing
The Geekbench listing reveals that the upcoming HONOR smartphone has the LRA-AN00 model number. The upcoming smartphone has scored 1,732 points in single-core and 4,431 points in multi-core tests. The HONOR Magic V Flip is said to be powered by an octa-core Snapdragon processor paired with up to 12GB of RAM.
The database reveals a Qualcomm chipset with the SM8475 codename that will power the upcoming Magic V Flip smartphone. For those unaware, the SM8475 is the codename of the popular Qualcomm Snapdragon 8+ Gen 1 SoC. However, the clock speeds revealed by the listing hints that HONOR will possibly equip the smartphone with an underclocked variant of the SoC.
To recall, Nothing launched the Nothing Phone (2) with a similar underclocked Snapdragon 8+ Gen 1 SoC. The underclocked variant has an architecture of one core (at 3.0GHz), three cores (at 2.5GHz), and four cores (at 1.80GHz). This is accompanied by an Adreno 730 GPU. In contrast, the official clock speeds of the Snapdragon 8+ Gen 1 SoC are 3.20GHz, 2.75GHz and 2.0GHz.
HONOR recently revealed that the phone’s cover screen could be the largest on a clamshell phone. Details are yet to be out. The 3C certification previously confirmed that HONOR will equip the device with 66W fast charging. Other expected specifications include a 50MP primary camera, a 4,500mAh battery, and more.
