After launching the Dimensity 9400+ SoC last month, MediaTek is already making headlines again. Fresh details about its upcoming flagship, the Dimensity 9500 processor, have now emerged. Here's a full breakdown of what's been revealed.
MediaTek Dimensity 9500 SoC: What to Expect?
Renowned tipster Digital Chat Station reports that the Dimensity 9500 will be manufactured using TSMC's advanced N3P 3nm process. It's set to feature an all-large core architecture comprising 1 Travis core, 3 Alto cores, and 4 Gelas cores. Both Travis and Alto belong to ARM's next-gen X9 series with SME instruction set support, while Gelas represents the latest A7 large core series.
On the graphics front, the chipset will pack the new Immortalis-Drage GPU, boasting a revamped microarchitecture to boost ray tracing and improve power efficiency. Other highlights include full AI capabilities, 16MB of L3 cache, 10MB of SLC, an upgraded NPU 9.0, and an estimated 100 TOPS of computing power. It will also pair with 10,667Mbps LPDDR5X RAM and quad-channel UFS 4.1 storage.
Remains on 3nm Architecture
Initially, MediaTek aimed to adopt TSMC's 2nm process, but the steep costs and Apple's early takeover of production for its A20 Pro chip—set to power the 2026 iPhone 18 series—forced MediaTek to rethink. As a result, the company has decided to stick with the 3nm process for now.
For now, this is all the information we have. But don't worry, keep an eye on MySmartPrice for updates as soon as more details come in.
