HONOR recently unveiled the HONOR Magic V3 foldable smartphone in the Chinese market. Today, our team at MySmartPrice has spotted the global variant of the upcoming foldable smartphone in the Geekbench database and multiple certifications, including IMDA, TDRA, and more.
HONOR Magic V3 Geekbench Listing
The upcoming HONOR smartphone has been listed on the Geekbench database with the FCP-N49 model number. We also spotted the smartphone in the TDRA certification with the same model number, which confirms the HONOR Magic V3 moniker.
The upcoming smartphone has scored 1914 points in single-core and 5354 points in multi-core tests. HONOR will equip the smartphone with an octa-core SoC with a peak clock speed of 3.30GHz and pair it with 12GB of RAM and an Adreno 750 GPU. The identifiers confirm that the Qualcomm Snapdragon 8 Gen 3 SoC will power the foldable device.
The moniker of the smartphone was also revealed through the GCF and TUV Rheinland certifications. As per the TUV Rheinland certification, the Magic V3 will sport IPX0 certification and will also be available in another variant with satellite connectivity.
The SGS Fimko certification divulges that the smartphone will be powered by the Qualcomm Snapdragon 8 Gen 3 SoC. The smartphone is also confirmed to run on Magic OS 8.0 based on Android 14 out of the box.
Apart from this, we also spotted the smartphone in the IMDA and EEC certifications, which reveal the FCP-N49 model number. The certifications confirm that the Magic V3 will soon launch in Singapore, South Korea, UAE, and European markets.
