Oppo is gearing up to launch its next-gen flagship series, the Oppo Reno7 series in China. Earlier this week, the first leak gave us information on the camera sensor of the vanilla Oppo Reno7 and now a fresh leak has given us information on the chipset of the whole Reno7 series – Reno7, Reno7 Pro, and Reno7 Pro Plus. Like last year’s Oppo Reno6 series is also expected to come with Snapdragon as well as MediaTek Dimsnity series chipset.
Oppo Reno7 series chipset leaked
According to a tipster on the Chinese social media platform, Weibo, the Reno7 series will follow the same strategy as the Reno6 series in terms of processing power. The top of the line Oppo Reno7 Pro Plus is expected to feature Snapdragon 888 processor, the Oppo Reno7 Pro is tipped to feature MediaTek Dimensity 1200 chipset, and lastly, the vanilla Reno7 is said to feature Dimensity 920 SoC.
For context, the Reno6 Pro Plus is powered by the Qualcomm Snapdragon 870 chipset while the Reno 6 features the Dimensity 900 SoC and the Reno6 Pro uses the Dimensity 1200 processor. The tipster also suggests that the chipset on the Reno7 Pro might be different than what he suggests (Dimensity 1200) as the same chipset is also powering the Reno6 Pro.
In terms of specification, we don’t have much information on the Reno7 series devices yet. But, earlier this week we learnt that the vanilla Oppo Reno7 might feature a 50MP Sony IMX 766 sensor which is an upgrade from Omnivision’s OV64B sensor found on the Oppo Reno6 device.
In terms of other features, the Reno7 is likely to stick with the same design language as its predecessor with a flat display and punch-hole camera. It is said to feature a metal frame and a three-camera setup on the back. While we still don’t have the launch date for the Reno7 series in China, the Oppo Pad tablet is also expected to tag alongside the Reno7 series.
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