At the starting of this year, Xiaomi launched its Mi 10 series, later the company came up with its Mi 10T series in the global market. As we are moving closer to the end of 2020 the eyes are now up for the upcoming Xiaomi Mi 11 series and we have also started noticing new leaks and rumours. According to a report some Weibo bloggers has recently posted a set of renders of the alleged Xiaomi Mi 11 disclosing the design of the handset.
According to or a Weibo blogger, the alleged Mi 11 series is going to arrive with a new and unique design. The design looks similar to the square and tough form factor like the Mi 3 and the smartphone is said to feature dual-curved screen design which is said to feature an under-screen camera sensor. The renders look very interesting.
Previous leaks render also expect that the Xiaomi Mi 11 series will be powered by the Qualcomm Snapdragon 875 SoC, based on the 5nm processor with quad-core design. The report also suggests that the processor will have a 23 percent better performance than the Cortex A78. Qualcomm Snapdragon 865 was listed on AnTuTu listing and managed to score 650,000 points and the Snapdragon 875 with Cortex X1 super core achieves more than 700,000 points.
Furthermore, the upcoming alleged Xiaomi Mi 11 series is expected to launch in the first quarter of 2021. It has been expected that the under-display camera sensor and Snapdragon 875 chipset will be the biggest highlights of the Xiaomi Mi 11 series and company will brag about it among the others.
So far we have this much information about the forthcoming Mi 11 series, we can expect some more information about the phone as we move closer to the launch. Also, do note that this information is based out of renders and rumours, so we recommend you to take it with a grain of salt.
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