MediaTek has announced the MediaTek Dimensity 6300 5G chipset is built on a 6nm process and is meant for budget smartphones. The Dimensity 6300 5G chipset will succeed the popular MediaTek Dimensity 6100+ SoC, which powered many smartphones, including the Realme 12 5G, Samsung Galaxy F15 5G, and more.
MediaTek Dimensity 6300 5G SoC: Features, Specifications
The Dimensity 6300 chipset comes with the MediaTek HyperEngine, which enables the CPU to reach 2.4GHz clock speed. The company claims that the SoC offers a 10% faster gaming experience than its predecessor. The Dimensity 6300 SoC will offer 50% better GPU performance.
MediaTek also claims that the processor can extend the gameplay up to 11% with an increase in power efficiency. The chipset is also claimed to feature intelligent connection prediction between 5G and Wi-Fi, 5G call and data concurrency, and more. Take a look at the technical specs of the newly launched MediaTek SoC.
- CPU: 2x Cortex A76 at 2.4GHz, 6x Cortex A55 at 2.0GHz.
- GPU: Arm Mali G57 MC2 GPU.
- Memory: LPDDR4x 2133MHz, UFS 2.2.
- Camera: 16MP+16MP, 108MP, Hardware MFNR.
- Display: AMOLED, Up to 120Hz, Full HD+ (2520 x 1080 pixels) resolution.
- Connectivity: 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), Bluetooth 5.2, Wi-Fi 5, GPS L1CA+L5, BeiDou B1I+ B2a, Glonass L1OF, Galileo E1 + E5a, QZSS L1CA+ L5, NavIC.
MediaTek Dimensity 6300 SoC to Power Upcoming Smartphones
Realme’s upcoming Realme C65 5G smartphone is expected to debut with the new Dimensity 6300 SoC. The smartphone is confirmed to fall within the sub-Rs 10,000 segment in India. More devices should be revealed soon.
