A couple of weeks back, MediaTek unveiled its latest flagship processor, the Dimensity 9000 based on a 4nm process to take on the new Snapdragon SoC launching this week. Now, it looks like the company is gearing up to announce a new budget chipset, which sits below the flagship SoC.
A popular tipster on Weibo, Digital Chat Station, in a post has revealed key features of the upcoming Dimensity 7000 SoC. As per the leak, the new MediaTek Dimensity 7000 is said to have a 5nm fabrication process. It will include four Cortex A78 cores clocked at 2.75GHz and four Cortex A55 cores clocked at 2GHz. The processor will feature Mali-G510 MC6 GPU.
The Mali-G510 is the successor to the Mail G57 which is featured on phones like Realme X7, Poco M4 Pro, and more. As per Arm, the Mali-G510 is expected to boost performance by 100% and 22% more energy-efficient as compared to the Mali G57.
For context, the recently launched Dimensity 9000 comes with one prime X2 core clocked at 3.05GHz along with three Cortex-A710 performance cores with a clock speed of 2.85GHz and four efficiency cores clocked at 1.8GHz. The graphics and gaming performance is taken care of by a 10-core Mali-710 GPU.
For the initial leaks, it looks like the MediaTek Dimensity 7000 processor will be used on more budget devices and more certainly it will be a 5G capable SOC, just like the rest of the Dimsnsity lineup. A recent leak reveals that the upcoming Redmi K50 series or an upcoming Redmi phone is expected to feature the Dimensity 7000 processor.
MediaTek is hosting an event in China on December 16 to officially launch the Dimsnsity 9000 in the country. While we are not 100% sure at this point, the coming might announce the Dimsnsity 7000 on the same stage or at least spill some information on the upcoming budget-friendly 5G chipset from the brand.
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