- The smartphones with Dimensity 6100+ will debut in third quarter of 2023.
- The chipset includes two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores.
- The Dimensity 6100+ SoC has up to 108MP Non-ZSL camera support.
Taiwanese semiconductor manufacturer MediaTek has launched the MediaTek Dimensity 6100+ SoC under the Dimensity 6000 series. This new offering from MediaTek offers exceptional power efficiency, vivid displays, high frame rates, AI-powered camera technologies, and reliable Sub-6 5G connectivity. The Dimensity 6100+ chipset integrates an enhanced 5G modem, supports 10-bit displays, and has powerful camera features including AI-bokeh for stunning portraits and selfies. Let us take a look ahead as to what more this new SoC offers:
MediaTek Dimensity 6100+ Features
The newly launched MediaTek Dimensity 6100+ is an octa-core 6nm processor which comprises of two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores. According to MediaTek, this new chipset offers notable enhancements, including support for AI-powered cameras, 10-bit displays, outstanding UX and GPU performance, and rich peripheral features. This new chipset has up to 108MP Non-ZSL camera support and it can also capture 2K videos at 30 fps.
Furthermore, the Dimensity 6100+ chipset also has UltraSave 3.0+ technology support which offers 20% reduced 5G power consumption compared to competitive solutions. As mentioned above, this new SoC also has camera features including AI-bokeh for capturing stunning selfies. MediaTek also has mentioned that it is working with Arcsoft for bringing AI-color technology to mainstream devices so users can showcase their creativity.
The Dimensity 6100+ processor also has premium 10-bit display support. It also supports 90Hz to 120Hz frame rates for a smooth user experience. This new chipset also has MediaTek HyperEngine 5.0 gaming technology support which offers smooth performance in game engines and intense gameplay. The Dimensity 6100+ also features a 3GPP Release-16 standard 5G modem. The chipset has support for LPDDR4x memory and UFS 2.2 storage. The Dimensity 6100+ can be paired with Mali-G57 MC2.
Last but not least, this new chipset supports several connectivity options such as Wi-Fi 5, Bluetooth v5.2, GPS (L1CA+L5), BeiDou, Glonass, Galileo, QZSS, NavIC, 4G Carrier Aggregation, SA/NSA modes. As for availability, the smartphones with Dimensity 6100+ will debut in markets in the third quarter of 2023.
To recall, MediaTek had introduced the Dimensity 6000 series SoCs such as Dimensity 6020 and the Dimensity 6080 chipsets earlier this year. The Dimensity 6020 is a 7nm SoC, whereas the Dimensity 6080 is manufactured using a 6nm process. The Dimensity 6020 SoC has two Cortex-A76 cores and six Cortex-A55 cores, whereas the Dimensity 6080 features two Cortex-A76 cores and six Cortex-A55 cores. Both these chipsets have MediaTek HyperEngine 5.0 gaming technology support, dual 5G SIM support, and they can be paired with LPDDR4x RAM and UFS 2.2 storage.