Xiaomi Could be Working on a Samsung Galaxy Z Flip-like Foldable Flip Phone, CNIPA Patent Listing Reveals

Let’s take a look at the Xiaomi foldable smartphone patent design spotted on the CNIPA.


Xiaomi launched its first foldable smartphone, the Mi Mix Fold, earlier this year. The new Xiaomi foldable smartphone is yet to hit the Indian shores. There is no official word on the Mi Mix Fold’s launch in India. Meanwhile, Xiaomi seems to be working on another foldable smartphone. The Chinese smartphone giant has filed for a patent for its next foldable smartphone design. Based on the attached images, it looks like the device will sport a clamshell-like foldable design. Xiaomi has not yet officially announced any details around a new clamshell foldable smartphone. Meanwhile, let’s take a look at the Xiaomi foldable smartphone patent design spotted on the CNIPA.

New Xiaomi foldable smartphone with a Samsung Galaxy Z Flip-like design in the works

Xiaomi could soon launch a new foldable smartphone. The company has filed for a patent of a clamshell foldable phone design on the CNIPA. The images attached with the patent document reveal the device’s design and the implementation of the foldable form factor.

It reveals that the Xiaomi flip phone will have a clamshell foldable design. The design is similar to the Galaxy Z Flip which was launched in 2020. Samsung is also working on a new Flip 3 that is rumoured to launch in August. 

Coming back to the patent, the images reveal that the display will have a pill-shaped cutout on the top-left corner. The hinge is located on either side of the edges. It also has slightly thick bezels around the display. On the back, there is a huge circular cutout housing a triple-camera setup. The LED flash seems to have found its spot on the top-left corner of the rear panel. On the right edge are the power and volume keys. It is likely that the foldable phone from Mi will have a side-mounted fingerprint scanner. The patent images show no signs of a secondary display that could be used for checking incoming calls and notifications.

Other details include a USB Type-C cutout between the SIM tray and the speaker grille on the bottom edge. The 3.5mm headphone jack cutout is missing from the patent images. It looks like the Mi Flip phone will come with a dedicated audio jack. 

Specifications of the flip foldable phone remain unknown. There is no word on the official release of this device at the time of writing this. You can check more details in the patent document below.

Xiaomi Flip Phone Patent CNIPA

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