MediaTek unveiled its latest chipset, the Dimensity 8300. The Taiwanese giant’s creation not only promises a revolutionary leap in energy efficiency and connectivity but introduces generative AI capabilities that are claimed to reshape the smartphone experience in the coming time. Here’s a quick dive into the features and specs that make this chipset a game-changer:
MediaTek Dimensity 8300 Features and Specifications
- Processing Power: Built on TSMC’s second-gen 4nm process, the Dimensity 8300 boasts an octa-core CPU featuring four Cortex-A715 cores and four Cortex-A510 cores, all running on Arm’s v9 CPU architecture. The Mali-G615 MC6 GPU adds the extra muscle for a seamless experience.
- Generative AI Capabilities: Powered by the APU 780 AI processor, the Dimensity 8300 claims full generative AI support. This enables developers to harness the potential of large language models up to 10B, ensuring stable diffusion and innovative applications.
- Performance Boost: According to MediaTek, the APU 780 shares the architecture with the flagship Dimensity 9300 chipset, resulting in a 2x improvement in INT and FP16 computation. This translates to a 3.3x boost in AI performance compared to its predecessor, the Dimensity 8200.
- Imaging Prowess: Teaming up with the MediaTek 14-bit HDR-ISP Imagiq 980, the Dimensity 8300 allows users to capture 4K60 HDR videos and enjoy extended recording capabilities.
- Connectivity: The chipset comes equipped with a 3GPP Release-16 standard 5G modem, offering scenario-specific optimizations for enhanced connectivity in areas with weaker signals. Supporting 3CC carrier aggregation, it achieves up to 5.17Gbps downlink speeds.
- Wi-Fi 6E and Bluetooth Combo: MediaTek ensures a smooth transition between wireless technologies with upgraded Wi-Fi 6E performance featuring 160 MHz bandwidth, complemented by Wi-Fi/Bluetooth hybrid coexistence technology.
On a similar note, the Chinese smartphone maker Xiaomi has already announced that their upcoming Redmi K70e smartphone will draw power from the soon-to-be-released Dimensity 8300 chipset. The upcoming K70 series will encompass the K70, K70 Pro, and K70E smartphones. Redmi’s teaser has confirmed the anticipated debut of the K70 series phones in November.
