- Qualcomm and MediaTek are preparing to release their mid-range chipsets in the next few weeks.
- According to leaks, both the Snapdragon 7 Gen 3 and Dimensity 8300 will be unveiled around similar timeframes.
- The Snapdragon 7 Gen 3 is reportedly designed with the same 1+3+4 architecture as its predecessor, including one prime core, three performance cores, and four efficiency cores.
Qualcomm and MediaTek are gearing up to release their sub-flagship processors in the upcoming weeks. Recently, the soon-to-be-launched Snapdragon 7 Gen 3 specifications were leaked online. On the other hand, there are reports that the soon-to-be-announced Dimensity 8300 chipset will power the forthcoming Redmi K70e. Now, a new leak has surfaced on the internet, disclosing the expected launch timeframe for both these chipsets.
Snapdragon 7 Gen 3 and Dimensity 8300 Launch Timeframe
According to information from the tipster WHY LAB, both chipsets are set to debut within the next two weeks. There is speculation that the Honor 100, scheduled for debut on November 23 in China, will be the first phone to incorporate the Snapdragon 7 Gen 3 chip. This same SoC is anticipated to power other smartphones, including the Vivo S18, Vivo V30, and the global version of the OnePlus Ace 3 (also known as the OnePlus Nord 4). On the contrary, the Redmi K70e seems to be a likely candidate to feature the Dimensity 8300 chipset. The K70 series, which includes the K70 and K70 Pro, is expected to launch in China by the end of this month.
Qualcomm Snapdragon 7 Gen 3 Specifications (Expected)
The Snapdragon 7 Gen 3 is said to be designed with the same 1+3+4 architecture as its predecessor, comprising one prime core, three performance cores, and four efficiency cores. The prime core is purportedly clocked at 2.63GHz, with the performance cores potentially running at 2.4GHz. Meanwhile, the efficiency cores are expected to have a clock speed of 1.8GHz. An ARM Cortex-A715 could power this configuration.
The SoC is expected to carry the model number SM7550. The leak indicates that the Snapdragon 7 Gen 3, being developed using TSMC’s 4nm process, is currently under testing and is anticipated to be paired with the Adreno 720 GPU.
MediaTek Dimensity 8300 Specifications (Expected)
Regarding the Dimensity 8300, speculation suggests that it will incorporate a single Cortex-X3 super-large core clocked at 2.8GHz, complemented by three Cortex-A715 performance cores running at 2.4GHz and four Cortex-A510 efficiency cores operating at 1.6GHz. On the graphics front, the Dimensity 8300 is expected to integrate a G520 MC6 GPU with a frequency of 850MHz.
Since their expected launch is just around the corner, we would not need to wait for long to know the exact specifications and devices these chipsets will be powering.