MediaTek has launched a new mid-range 5G smartphone chipset in China. The company has unveiled the Dimensity 900 SoC in China. It is rumoured to power the upcoming Reno6 in China. The 5G chipset is based on TSMC’s 6nm fabrication. It has a total of eight cores, two of which are A78 high-performance cores clocked at 2.4GHz. The chipset also includes six A55 efficiency cores clocked at 2.0GHz. For graphics, the Dimensity 900 SoC comes with an ARM Mali-G68 GPU. It supports dual-band 5G and Wi-Fi 6. Let’s take a look at more details on the MediaTek Dimensity 900 SoC.
MediaTek Dimensity 900 SoC launched in China; likely to feature in OPPO Reno6
MediaTek has unveiled the new Dimensity 900 5G SoC in China. The processor is rumoured to feature in the upcoming OPPO Reno6.
MediaTek’s latest 5G processor is built on TSMC’s 6nm fabrication. It is an octa-core processor with two performance cores and six efficiency cores. The two A78 cores are clocked at 2.4GHz. It also has six A55 efficiency cores clocked at 2.0GHz. The SoC supports flagship LPDDR5 memory and UFS 3.1 storage. The chipset also integrates an ARM Mali-G68 MC4 GPU, along with an independent artificial intelligence (AI) processing unit that delivers optimal power efficiency for extended battery life. It also comes with MediaTek’s HyperEngine gaming engine.
The chipset also comes with support for Wi-Fi 6, Bluetooth 5.2 connectivity and dual-band 5G. Smartphones running on the chipset can support a Full HD+ 120Hz display and a 108MP primary camera. It comes with a MiraVision HDR Video technology that adjusts a wide range of video stream factors, including colour, brightness, contrast, sharpness, and dynamic range.
MediaTek has announced that the Dimensity 900-powered phones will launch in global markets in Q2 2021. The upcoming OPPO Reno6 is also rumoured to feature the latest MediaTek Dimensity chipset. You can click here to check our coverage of the OPPO Reno6 series.